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Introducing the Relife RL-044 OT2 BGA IC Reballing Stencil, designed for Android Nand Flash EMMC EMCP UFS LPDDR PCIE BGA162 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA200 BGA110 BGA60 BGA70 and similar EMMC:1 EMMC:2 EMMC:3. This precision tool is essential for soldering and reballing tasks, ensuring accurate and efficient results. Ideal for professionals and DIY enthusiasts in the field of electronics and mobile device repair.

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• Relife RL-044 OT2
• Similar as EMMC:3 EMMC:2 EMMC:1
• BGA Reballing Stencil
• for Android Hard Disk EMMC EMCP UFS Phone Nand Flash
• BGA IC Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCIE 
• Supported chip BGA162 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA200 BGA110 BGA60 BGA70
• STENCIL 

• IC REBOLING PLATE

• FAST SELLING

• MANY MODEL WORKING