- Type:Silicon fluid
- Physical Form:Grease-like
- Primary Use:Thermal cupling of electronics device to heat sinks
- Special Properties:High conductivity,low bleed,stable at high temperatures
- Thermal conductivity:>1.93W/m-K
- Type:Silicon fluid
- Physical Form:Grease-like
- Primary Use:Thermal cupling of electronics device to heat sinks
- Special Properties:High conductivity,low bleed,stable at high temperatures
- Thermal conductivity:>1.93W/m-K
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