1pcs HY510 Heatsink Compounds for PC CPU GPU ,Transistor, IC, Cooling


Tk 120
Tk 204
Tk 204
41% OFF
  • Type:Silicon fluid
  • Physical Form:Grease-like
  • Primary Use:Thermal cupling of electronics device to heat sinks
  • Special Properties:High conductivity,low bleed,stable at high temperatures
  • Thermal conductivity:>1.93W/m-K



  • Type:Silicon fluid
  • Physical Form:Grease-like
  • Primary Use:Thermal cupling of electronics device to heat sinks
  • Special Properties:High conductivity,low bleed,stable at high temperatures
  • Thermal conductivity:>1.93W/m-K






  • Type:Silicon fluid
  • Physical Form:Grease-like
  • Primary Use:Thermal cupling of electronics device to heat sinks
  • Special Properties:High conductivity,low bleed,stable at high temperatures
  • Thermal conductivity:>1.93W/m-K
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