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Brand HP
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Series EX900 M.2
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Capacity 250GB
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Form Factor M.2 2280
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Memory Components 3d TLC NAND
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Interface PCI-Express 3(8Gb/s)x4, NVMe 1.3
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Max Sequential Read Up to 2,100 MBps
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Max Sequential Write Up to 1,300 MBps
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Read Latency 0.028ms
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Write Latency 0.035ms
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MTBF 2,000,000 hours
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Power Consumption (idle) 0.68W
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Power Consumption (active) 2.99W
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Operating Temperature 0°C ~ +70°C
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Storage Temperature -40°C ~ +85°C
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Max Shock Resistance 100G / 6 msec
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Max Vibration Resistance 3.1 GRMS (2-500 Hz)
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Height 2.4mm
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Width 22.0mm
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Depth 80.00mm
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Weight 5.4g
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Warranty 3 Years Replacement
- Brand HP
- Series EX900 M.2
- Capacity 250GB
- Form Factor M.2 2280
- Memory Components 3d TLC NAND
- Interface PCI-Express 3(8Gb/s)x4, NVMe 1.3
- Max Sequential Read Up to 2,100 MBps
- Max Sequential Write Up to 1,300 MBps
- Read Latency 0.028ms
- Write Latency 0.035ms
- MTBF 2,000,000 hours
- Power Consumption (idle) 0.68W
- Power Consumption (active) 2.99W
- Operating Temperature 0°C ~ +70°C
- Storage Temperature -40°C ~ +85°C
- Max Shock Resistance 100G / 6 msec
- Max Vibration Resistance 3.1 GRMS (2-500 Hz)
- Height 2.4mm
- Width 22.0mm
- Depth 80.00mm
- Weight 5.4g
Warranty: 3 Years Replacement Warranty
Note: Product delivery duration may vary due to product availability in stock.
Disclaimer: The actual color of the physical product may slightly vary due to the deviation of lighting sources, photography or your device display settings.
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